ADIY GSM SIMA7670C 4G BREAKOUT BOARD (Ver 1.1)

The A7670C 4G GSM Breakout Module is a compact LTE cellular communication module based on the SIMCom A7670C chipset. It provides high-speed 4G LTE connectivity along with backward compatibility for 3G and 2G networks, making it suitable for IoT, telemetry, and embedded communication projects. The breakout board exposes essential power, UART, audio, and control pins for easy integration with microcontrollers and single-board computers.

Technical Specifications:

• Network support: 4G LTE, 3G UMTS, 2G GSM/GPRS
• LTE bands: Multiple regional LTE bands (variant dependent)
• Data speed: LTE Cat-1 class (up to ~10 Mbps downlink, ~5 Mbps uplink)
• Power supply: Typical 5V (high current capability required)SOLDRON
• Interface: UART (TXD, RXD), USB (optional)
• SIM interface: Nano SIM
• Antenna: External antenna via u.FL / IPEX connector
• Audio: MIC and Speaker pins supported
• Control pins: PWRKEY, RST, NET status, DTR, RI
• Operating temperature: Industrial range (approx. −30°C to +75°C)
• Form factor: Compact breakout PCB with castellated/module pins

Features:

• High-speed 4G LTE data communication
• Backward compatibility with 3G and 2G networks
• AT command controlled operation
• Supports TCP/IP, HTTP, HTTPS, FTP, MQTT, SMS, and voice
• On-board network and power status indicators
• External antenna support for improved signal strength
• Designed for easy prototyping and embedded integration

Applications:

• IoT and M2M communication devices
• Remote monitoring and telemetry systems
• Industrial automation and gateways
• GPS and vehicle tracking systems
• Smart meters and energy monitoring
• 4G-enabled embedded and edge computing projects